Substrate processing method and substrate processing apparatus

Details Substrate processing method and substrate processing apparatus Substrate processing method and substrate processing apparatus

2006-12-19

2009-10-27

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S010000, C451S011000, C451S044000, C451S054000, C451S398000, C451S446000

Reexamination Certificate

active

07607967

ABSTRACT:
A holding mode is selectively switched, in accordance with the content of processing of a substrate, among three holding modes: (a) a first holding mode in which while first support pins F1through F12abut on the back surface of a substrate W and support the substrate W, the substrate W is held because of nitrogen gas which is supplied to the front surface of the substrate W; (b) a second holding mode in which while second support pins S1through S12abut on the edge surface of the substrate W as the substrate W moves along the horizontal direction, thereby restricting horizontal movement of the substrate W, and abut on the back surface of the substrate W, thereby supporting the substrate W, the substrate W is held because of nitrogen gas which is supplied to the back surface of the substrate W; and (c) a third holding mode in which while the first and the second support pins F1through F12and support pins S1through S12abut on the back surface of the substrate W, the substrate W is held because of nitrogen gas which is supplied to the front surface of the substrate W.

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U.S. Office Action issued in corresponding U.S. Appl. No. 11/154,363.

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