Substrate processing method

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

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C438S780000, C438S788000, C438S790000, C438S798000

Reexamination Certificate

active

07662728

ABSTRACT:
A method of forming a low-K dielectric film, comprises the steps of placing a substrate carrying thereon a low-K dielectric film on a stage, heating the low-K dielectric film on the stage, processing the low-K dielectric film by plasma of a processing gas containing a hydrogen gas, the plasma being excited while supplying the processing gas over the low-K dielectric film, wherein the plasma is excited within 90 seconds after placing the substrate upon the stage.

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patent: WO 00/51174 (2000-08-01), None
patent: WO 01/01472 (2001-01-01), None
patent: WO 02/059956 (2002-08-01), None

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