Cleaning and liquid contact with solids – Apparatus – Electrically controlled
Reexamination Certificate
2007-03-20
2007-03-20
Perrin, Joseph L. (Department: 1746)
Cleaning and liquid contact with solids
Apparatus
Electrically controlled
C134S102100, C134S105000, C134S902000
Reexamination Certificate
active
10606135
ABSTRACT:
Semiconductor wafers are cleaned by placing the semiconductor wafers in a processing vessel, forming a pure water film on the surfaces of the wafers, forming an ozonic water film by dissolving ozone gas in the pure water film, and removing resist films formed on the wafers by the agency of the ozonic water film. The pure water film is formed by condensing steam on the surfaces of the wafers. The resist films formed on the surfaces of the wafers can be removed by also using hydroxyl radicals produced by interaction between steam and ozone gas supplied into the processing vessel. Thus, the resist films can be removed highly effectively.
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Iino Tadashi
Kamikawa Yuji
Toshima Takayuki
Tsutsumi Hideyuki
Ueno Kinya
Morrison & Foerster / LLP
Perrin Joseph L.
Tokyo Electron Limited
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