Substrate processing apparatus equipping with high-pressure...

Details Substrate processing apparatus equipping with high-pressure... Substrate processing apparatus equipping with high-pressure...

2005-01-11

2005-01-11

Mills, Gregory (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C118S719000

Reexamination Certificate

active

06841031

ABSTRACT:
With respect to any one of processing units, a main transportation path, a developing unit, a dedicated transportation robot and a high-pressure processing unit are disposed linearly in this order in a direction. Hence, even if a processing fluid adhering to a substrate or an evaporant of the processing fluid moves toward the main transportation path while the high-pressure processing unit transports the substrate wet with the processing fluid, there are the processing units located which the processing fluid or its evaporant must arrive at before reaching the main transportation path.

REFERENCES:
patent: 5700379 (1997-12-01), Biebl
patent: 6074515 (2000-06-01), Iseki et al.
patent: 6270619 (2001-08-01), Suzuki et al.
patent: 6354794 (2002-03-01), Sato et al.
patent: 6413355 (2002-07-01), Kamikawa et al.
patent: 6439824 (2002-08-01), Harris et al.
patent: 6524429 (2003-02-01), Nogami et al.
patent: 19506404 (1996-03-01), None
patent: 0732557 (1996-09-01), None
patent: 7-142355 (1995-06-01), None
patent: 8-250464 (1996-09-01), None
patent: 9-139374 (1997-05-01), None
patent: 28299009 (1998-12-01), None
patent: 11-145351 (1999-05-01), None
patent: 2000-91180 (2000-03-01), None
patent: 2000-138156 (2000-05-01), None

Affiliated with

Also associated with

Rating

Substrate processing apparatus equipping with high-pressure... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus equipping with high-pressure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus equipping with high-pressure... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3422696