Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

2006-03-27

2010-08-03

Kornakov, Michael (Department: 1714)

Cleaning and liquid contact with solids

Processes

Including use of vacuum, suction, or inert atmosphere

C134S026000

Reexamination Certificate

active

07767026

ABSTRACT:
An on-off valve81is opened during rinsing, whereby a part of DIW supplied to a processing liquid supply section43is guided into inside a suction pipe82. After rinsing, a puddle is formed between a lower cleaning nozzle29and the bottom surface of a wafer. As the on-off valve81is opened while an on-off valve86is kept close, the puddle is sucked at a first speed (V1) which is regulated by a needle valve85and set to a relatively slow speed. Once the puddle is collected into inside the lower cleaning nozzle29, the on-off valve86is opened so that the puddle is sucked at a second speed (V2) which is regulated by a needle valve84and which is faster than said first speed.

REFERENCES:
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patent: 2004/0187891 (2004-09-01), Chou et al.
patent: 8-31745 (1996-02-01), None
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Computer Translation of JP 2003-309102 by Orii, published Oct. 31, 2003.
Notice of Allowance issued on Jan. 19, 2010 in connection with corresponding Japanese Application No. 2005-094744 (JP2003-309102 was previously submitted in an Information Disclosure Statement filed Jul. 10, 2006 and is therefore not enclosed.).
Office Action issued on Jan. 19, 2010 in connection with corresponding Japanese Application No. 2005-094745 (JP2003-309102 was previously submitted in an Information Disclosure Statement filed Jul. 10, 2006 and is therefore not enclosed.).

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