Substrate processing apparatus and substrate processing method

Details Substrate processing apparatus and substrate processing method Substrate processing apparatus and substrate processing method

2005-04-12

2005-04-12

Lund, Jeffrie R. (Department: 1763)

Etching a substrate: processes

Nongaseous phase etching of substrate

Recycling, regenerating, or rejunevating etchant

C216S083000, C216S084000, C156S345150, C156S345180, C156S345240, C156S345500, C134S010000, C134S033000, C134S104200, C134S109000, C134S113000, C427S240000, C427S421100, C427S425000, C118S052000, C118S602000, C118S712000

Reexamination Certificate

active

06878303

ABSTRACT:
A substrate processing apparatus for supplying a treatment liquid onto the surface of a substrate to treat the same. This apparatus is provided with: a spin chuck for holding and rotating a substrate; a nozzle for supplying a treatment liquid to the substrate held by the spin chuck; a circulating passage arranged such that the treatment liquid supplied to the substrate from the nozzle and used for substrate treatment is circulated to the nozzle and reutilized for substrate treatment; a metal contamination amount measuring device for measuring the metal contamination amount in the treatment liquid passing through the circulating passage; and a judgment processing unit for judging whether or not the value measured by the metal contamination amount measuring device has exceeded a predetermined set value.

REFERENCES:
patent: 6200414 (2001-03-01), Hwang et al.
patent: 6551422 (2003-04-01), O'Connor
patent: 6736926 (2004-05-01), Chopra et al.
patent: 20020036501 (2002-03-01), Astley et al.
patent: 20030132193 (2003-07-01), Okamoto
patent: 63-137430 (1988-06-01), None
patent: 11-345849 (1999-12-01), None

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