Substrate processing apparatus and method with proximity...

Drying and gas or vapor contact with solids – Process – Gas or vapor contact with treated material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C034S090000

Reexamination Certificate

active

07373736

ABSTRACT:
A proximity member moves in a moving direction (−X) in a condition that an opposed surface of the proximity member is disposed in the vicinity of a substrate surface and that a liquid-tight layer is formed between the opposed surface and the substrate surface, and nitrogen gas is discharged toward an upstream-side interface of the liquid-tight layer from the upstream side (+X) to the proximity member in the moving direction. Thus discharged nitrogen gas is blown selectively and in concentration against an exposed interface portion, a rinsing liquid forming the exposed interface portion is blown away from the substrate surface and the liquid-tight layer, and a substrate surface region which corresponds to the exposed interface portion is dried.

REFERENCES:
patent: 3950184 (1976-04-01), Adams et al.
patent: 5871584 (1999-02-01), Tateyama et al.
patent: 6073369 (2000-06-01), Yasuyuki
patent: 6446358 (2002-09-01), Mitsumori et al.
patent: 6858092 (2005-02-01), Langen
patent: 7279044 (2007-10-01), Park et al.
patent: 7-29866 (1995-01-01), None
patent: 2922754 (1999-04-01), None
patent: 2001-33165 (2001-02-01), None
patent: 2003-31545 (2003-01-01), None
patent: 2003-151947 (2003-05-01), None
patent: 2004-335840 (2004-11-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrate processing apparatus and method with proximity... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus and method with proximity..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus and method with proximity... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2776386

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.