Coating apparatus – Gas or vapor deposition – Multizone chamber
Reexamination Certificate
2005-08-02
2005-08-02
Bueker, Richard (Department: 1763)
Coating apparatus
Gas or vapor deposition
Multizone chamber
C118S724000, C118S725000, C118S726000
Reexamination Certificate
active
06923867
ABSTRACT:
A substrate processing apparatus and a method for manufacturing a semiconductor device can supply the vapor of the raw material to the substrate without fail. A main heater22is prepared outside the outer tube21, an inner tube23is prepared inside the outer tube21, a cap24that can be lifted and lowered is inserted in the inner tube23, a boat25is mounted on the cap24, a raw material sublimation portion46and a heat insulating portion36are prepared on the cap24, a heater portion45is set up with possible attachment and detachment on the cap24, a sublimation heater26of the heater portion45is located inside the reaction chamber, a raw material loading board34of the raw material sublimation portion46is prepared on the upper portion of the sublimation heater26, a plurality of pole members35are prepared around the raw material loading board34, the heat insulation portion36is supported by the pole member35, and the heat insulating portion36is located between the raw material sublimation portion46and the substrate processing area, and the heat insulating portion36is packed with a quartz wool.
REFERENCES:
patent: 3007819 (1961-11-01), McNamara
patent: 3572672 (1971-03-01), Harel
patent: 3675619 (1972-07-01), Burd
patent: 3690290 (1972-09-01), Jarvela et al.
patent: 3858548 (1975-01-01), Tick
patent: 4100879 (1978-07-01), Goldin et al.
patent: 4154631 (1979-05-01), Schoolar
patent: 4226208 (1980-10-01), Nishida et al.
patent: 4227948 (1980-10-01), Jensen et al.
patent: 4264803 (1981-04-01), Shinko
patent: 4330932 (1982-05-01), Morris et al.
patent: 4668480 (1987-05-01), Fujiyashu et al.
patent: 5133286 (1992-07-01), Choo et al.
patent: 5168543 (1992-12-01), Murray
patent: 5343022 (1994-08-01), Gilbert et al.
patent: 5556472 (1996-09-01), Nakamura et al.
patent: 5827371 (1998-10-01), Colombo et al.
patent: 6296894 (2001-10-01), Tanabe et al.
patent: 6473564 (2002-10-01), Nagashima et al.
patent: 2001/0008121 (2001-07-01), Tanabe
patent: 2002/0182307 (2002-12-01), Lee et al.
patent: 2003/0026601 (2003-02-01), Jabbour
patent: 54-96360 (1979-07-01), None
patent: B2 6-28248 (1994-04-01), None
patent: WO 02/061170 (2002-08-01), None
Webster's Third New international Dictionary, Meriam-Webster, 1993, p. 2548.
Taniyama Tomoshi
Tometsuka Kouji
Yanagawa Shusaku
Bueker Richard
Hitachi Kokusai Electric Inc.
Oliff & Berridg,e PLC
Sony Corporation
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