Substrate processing apparatus and method

Details Substrate processing apparatus and method Substrate processing apparatus and method

2011-01-11

2011-01-11

Stark, Jarrett J (Department: 2823)

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

Ionized irradiation

C438S481000, C117S204000, C257SE21471

Reexamination Certificate

active

07867926

ABSTRACT:
A substrate processing apparatus is used for radiating UV rays onto a target film formed on a target surface of a substrate to perform a curing process of the target film. The apparatus includes a hot plate configured to heat the substrate to a predetermined temperature, a plurality of support pins disposed on the hot plate to support the substrate, and a UV radiating device configured to radiate UV rays onto the target surface of the substrate supported on the support pins. The support pins are preset to provide a predetermined thermal conductivity to conduct heat of the substrate to the hot plate. The hot plate is preset to have a predetermined thermal capacity sufficient to absorb heat conducted through the support pins.

REFERENCES:
patent: 2005/0079690 (2005-04-01), Suka et al.
patent: 62-26037 (1987-02-01), None
patent: 7-66162 (1995-03-01), None
patent: 9-153491 (1997-06-01), None
patent: 2004-186682 (2004-07-01), None
patent: 2004-282099 (2004-10-01), None
Japanese Office Action issued Oct. 22, 2009 for Japanese Application No. 2007-171354 w/partial English language translation.

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