Substrate processing apparatus and method

Details Substrate processing apparatus and method Substrate processing apparatus and method

2003-06-03

2009-10-27

MacArthur, Sylvia R. (Department: 1792)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With workpiece support

C118S500000, C118S728000, C156S345510

Reexamination Certificate

active

07608163

ABSTRACT:
In a substrate processing apparatus that supports substrates W by a plurality of holding members of a rotor to process the substrates W rotated by the rotor, any one of the holding members is provided with press devices130to apply pressures on the peripheries of the substrates W. Each press device130has an abutting part160for contact with the periphery of the substrate W, a cylinder mechanism161for moving the abutting part160between a position in contact with the periphery of the substrate W and another position apart from the periphery of the substrate W and a deformable part162elastically deformed by the movement of the abutting part160to isolate the cylinder mechanism161from an atmosphere around the substrates W. Consequently, it is possible to provide the substrate processing apparatus and method that do not cause a diaphragm to be deformed excessively.

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Computer-Generated English Translation of JP08-274060, published Oct. 18, 1996.

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