Substrate processing apparatus and method

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C134S095300, C118S073000

Reexamination Certificate

active

10481424

ABSTRACT:
A substrate processing apparatus has a substrate holder for detachably holding a substrate so that a surface, to be processed, of the substrate faces downward, and a sealing ring for sealing a peripheral portion of the surface, to be processed, of the substrate held by the substrate holder. The substrate processing apparatus also has a plurality of ejection nozzles disposed below the substrate holder for ejecting a treatment solution toward the surface, to be processed, of the substrate held by the substrate holder, and a mechanism for rotating and vertically moving the substrate holder and the ejection nozzles relative to each other.

REFERENCES:
patent: 5169491 (1992-12-01), Doan
patent: 6709563 (2004-03-01), Nagai et al.
patent: 6874516 (2005-04-01), Matsuno et al.
patent: 2002/0006876 (2002-01-01), Hongo et al.
patent: 2002/0157686 (2002-10-01), Kenny et al.
patent: 2002/0179120 (2002-12-01), Ono et al.
patent: 2003/0024645 (2003-02-01), Orii et al.
patent: 2004/0084318 (2004-05-01), Cohen
patent: 2004/0182277 (2004-09-01), Inoue et al.
patent: 2004/0234696 (2004-11-01), Hongo et al.
patent: 2004/0235237 (2004-11-01), Inoue et al.
patent: 2004/0235298 (2004-11-01), Inoue et al.
patent: 2004/0237896 (2004-12-01), Hongo
patent: 11-26415 (1999-01-01), None
patent: 2001-316879 (2001-11-01), None
patent: 2003-45839 (2003-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrate processing apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3840649

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.