Substrate processing apparatus and maintenance method therefor

Metal working – Barrier layer or semiconductor device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

414217, 118719, 20429835, H01L 2100, H01L 2164, C23C 1600, C23C 1400, C25B 900

Patent

active

061430404

ABSTRACT:
A substrate processing apparatus comprises a semiconductor wafer processing chamber, a wafer transfer device, a wafer cassette holding unit, a wafer cassette transfer device and a wafer cassette bringing in/out section disposed in this order and a housing. The wafer cassette holding unit is movable between a wafer processing time position and a maintenance time position thereof and the wafer cassette transfer device is movable between a wafer processing time position and a maintenance time position thereof. The wafer cassette bringing in/out section is capable of rotating forward of the housing, whereby the front face of said housing is opened. With the wafer cassette holding unit being positioned at the maintenance time position thereof, the wafer cassette transfer device being positioned at the maintenance time position thereof and the wafer cassette bringing in/out section being rotated forward of the housing to open the front face thereof, maintenance of the wafer transfer device can be performed from the front face of the housing.

REFERENCES:
patent: 5562383 (1996-10-01), Iwai et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Substrate processing apparatus and maintenance method therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate processing apparatus and maintenance method therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate processing apparatus and maintenance method therefor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1636414

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.