Metal working – Barrier layer or semiconductor device making
Patent
1998-02-27
2000-11-07
Graybill, David E.
Metal working
Barrier layer or semiconductor device making
414217, 118719, 20429835, H01L 2100, H01L 2164, C23C 1600, C23C 1400, C25B 900
Patent
active
061430404
ABSTRACT:
A substrate processing apparatus comprises a semiconductor wafer processing chamber, a wafer transfer device, a wafer cassette holding unit, a wafer cassette transfer device and a wafer cassette bringing in/out section disposed in this order and a housing. The wafer cassette holding unit is movable between a wafer processing time position and a maintenance time position thereof and the wafer cassette transfer device is movable between a wafer processing time position and a maintenance time position thereof. The wafer cassette bringing in/out section is capable of rotating forward of the housing, whereby the front face of said housing is opened. With the wafer cassette holding unit being positioned at the maintenance time position thereof, the wafer cassette transfer device being positioned at the maintenance time position thereof and the wafer cassette bringing in/out section being rotated forward of the housing to open the front face thereof, maintenance of the wafer transfer device can be performed from the front face of the housing.
REFERENCES:
patent: 5562383 (1996-10-01), Iwai et al.
Hirano Mitsuhiro
Marubayashi Tetsuya
Tometsuka Kouji
Graybill David E.
Kokusai Electric Co. Ltd.
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