Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With gas inlet structure
Reexamination Certificate
2008-10-28
2011-12-13
MacArthur, Sylvia R. (Department: 1716)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With gas inlet structure
C118S715000, C427S248100
Reexamination Certificate
active
08075731
ABSTRACT:
A gas injection head200is provided above a substantial center of a substrate W. Nitrogen gas introduced from a gas feed port291is injected from a slit-shaped injection port293via an internal buffer space BF. In this way, a radial gas flow substantially isotropic in a horizontal direction while having an injection direction restricted in a vertical direction is generated above the substrate. Thus, dust D, mist M and the like around the substrate are blown off in outward directions and do not adhere to the substrate W. The gas injection head200can be made smaller than the diameter of the substrate W and needs to be neither retracted from the substrate surface nor rotated, wherefore an apparatus can be miniaturized.
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Dainippon Screen Mfg. Co,. Ltd.
MacArthur Sylvia R.
Ostrolenk Faber LLP
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