Substrate processing apparatus

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

29 2501, 118719, 20429825, 20429835, 396571, 396611, 396642, 414217, 414935, 432253, H01L 2100

Patent

active

057627452

ABSTRACT:
A substrate processing apparatus includes a plurality of easily removable processing units including at least a heating unit for heating a substrate and a cooling unit for cooling the substrate, and an outer frame having a plurality of compartments. Each compartment has an opening through which a processing unit may be inserted or removed. The plurality of compartments are arranged vertically. Each compartment has a plurality of first joint members connected to utility lines including those of an electrical system, a control system, and a fluid system. The electrical, control, and fluid systems are necessary for operating the processing units. Each processing unit has a plurality of second joint members connected to the first joint members.

REFERENCES:
patent: 4722298 (1988-02-01), Rubin
patent: 5076205 (1991-12-01), Vowles et al.
patent: 5339128 (1994-08-01), Tateyama et al.

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