Substrate polishing apparatus and substrate polishing method

Details Substrate polishing apparatus and substrate polishing method Substrate polishing apparatus and substrate polishing method

2010-01-15

2010-12-21

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S011000, C451S041000, C451S059000, C451S288000, C324S229000

Reexamination Certificate

active

07854646

ABSTRACT:
The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22to25), and pressures in the respective chambers (22to25) are adjusted based on the film thickness measured by the film thickness measuring device (200).

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