Substrate-placing mechanism having substrate-heating function

Details Substrate-placing mechanism having substrate-heating function Substrate-placing mechanism having substrate-heating function

2007-11-27

2007-11-27

Gravini, S. (Department: 3749)

Drying and gas or vapor contact with solids

Apparatus

With means to treat gas or vapor

C324S765010

Reexamination Certificate

active

11367391

ABSTRACT:
The present invention is a substrate-placing mechanism to be provided in a processing container of a substrate-processing apparatus including: a stage having: a base body on which a substrate is placed, a heat-generating body for heating the substrate placed on the base body, and a feed terminal part for feeding electric power to the heat-generating body; a hollow supporting part fixed to a base of the processing container for supporting the stage; a connection terminal part fixed to the base of the processing container under the supporting part for being connected to an electric power source located outside the processing container; a feed member connected to the feed terminal part and extending in the hollow supporting part; and a spring member that connects the feed member and the connection terminal part.

REFERENCES:
patent: 5557215 (1996-09-01), Saeki et al.
patent: 5625526 (1997-04-01), Watanabe et al.
patent: 6047660 (2000-04-01), Lee
patent: 2001-160479 (2001-06-01), None

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