Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2011-01-11
2011-01-11
Nguyen, Ha Tran T (Department: 2829)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C324S754090, C324S1540PB, C324S765010, C029S843000, C029S825000
Reexamination Certificate
active
07867790
ABSTRACT:
Provided are a substrate of a probe card for installing a plurality of probes thereon to inspect an object by contacting the probes to the object, and a method for repairing the substrate. The substrate includes main channels electrically connected to the probes; and at least one spare channel for replacing the main channels when at least one of the main channels is damaged. Therefore, when some of the main channels of the probe substrate are damaged, the damaged main channels can be repaired using the spare channels and then the probe substrate can be reused, thereby reducing costs required for unnecessary replacement.
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Statement of Reasons for Invalidation Action and English translation from Taiwanese Patent Office dated Dec. 7, 2009.
Jeong Seong-Hoon
Yoo Jung-Sun
Chan Emily Y
Harness & Dickey & Pierce P.L.C.
Nguyen Ha Tran T
Phicom Corporation
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