Substrate of a hybrid ic, method of forming a circuit pattern an

Details Substrate of a hybrid ic, method of forming a circuit pattern an Substrate of a hybrid ic, method of forming a circuit pattern an

1987-07-01

1990-01-02

Robinson, Ellis P.

Coating processes

Electrical product produced

Welding electrode

427 96, 29825, 29829, 29840, 428901, B05D 306

Patent

active

048912425

ABSTRACT:
A hybrid IC substrate has a substrate body and a retaining film which is formed on a surface of the substrate body. The retaining film enables a solution containing a circuit-element-forming material to permeate therethrough and retains the solution on the substrate body. The solution, which is expelled onto the hybrid IC substrate in the form of liquid drops, permeates the above-mentioned retaining film and becomes attached to the surface of the substrate body. Then, the hybrid IC substrate is baked. The retaining film is thus baked off, thereby forming a film of the circuit-element-forming material as a circuit pattern on the substrate body.

REFERENCES:
patent: 4407860 (1983-10-01), Fleming et al.
patent: 4667401 (1987-05-01), Clements et al.
patent: 4707724 (1987-11-01), Suzuki et al.
Screening Process to Fabricate Electronic Circuitry Using Conductive Adhesives, ITD, vol. 6, No. 5, May 25, 1988.

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