Substrate of a hybrid IC, method of forming a circuit pattern an

Details Substrate of a hybrid IC, method of forming a circuit pattern an Substrate of a hybrid IC, method of forming a circuit pattern an

1989-10-17

1991-11-12

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428323, 428327, 428328, 4284111, 428901, 361397, 174250, B32B 900

Patent

active

050647113

ABSTRACT:
A hybrid IC substrate has a substrate body and a retaining film which is formed on a surface of the substrate body. The retaining film enables a solution containing a circuit-element-forming material to permeate therethrough and retains the solution on the substrate body. The solution, which is expelled onto the hybrid IC substrate in the form of liquid drops, permeates the above-mentioned retaining film and becomes attached to the surface of the substrate body. Then, the hybrid IC substrate is baked. The retaining film is thus backed off, thereby forming a film of the circuit-element-forming material as a circuit pattern on the substrate body.

REFERENCES:
patent: 4891242 (1990-01-01), Ito et al.
IEE Transactions, vol. CHMT-2, No. 4, 12-79, Thick Film Fine Pattern, Watanabe et al.

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