Substrate, method of manufacturing multi-layer substrate,...

Details Substrate, method of manufacturing multi-layer substrate,... Substrate, method of manufacturing multi-layer substrate,...

2007-04-10

2007-04-10

Vo, Tuyet (Department: 2821)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C343S7000MS

Reexamination Certificate

active

10896176

ABSTRACT:
A substrate includes a main substrate having a pattern as a first pattern layer on a main surface, a sub substrate having a dummy pattern as a second pattern layer on a main surface, a bridge (connection portion) connecting the main substrate and the sub substrate, and a thin portion provided on the bridge between the patterns. A multi-layer substrate is fabricated by laminating the main substrates separated from the sub substrate, and an LNB includes the multi-layer substrate.

REFERENCES:
patent: 5278685 (1994-01-01), Iwamoto et al.
patent: 5668563 (1997-09-01), Ogino et al.
patent: 6816028 (2004-11-01), Kato
patent: 7046197 (2006-05-01), Okado
patent: 4-15864 (1992-02-01), None
patent: 2003-204127 (2003-07-01), None

Affiliated with

Also associated with

Rating

Substrate, method of manufacturing multi-layer substrate,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Substrate, method of manufacturing multi-layer substrate,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate, method of manufacturing multi-layer substrate,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3756185