Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate
2005-01-11
2005-01-11
Zarneke, David A. (Department: 2827)
Active solid-state devices (e.g., transistors, solid-state diode
Test or calibration structure
Reexamination Certificate
active
06841796
ABSTRACT:
A method and apparatus relating to fabricating semiconductor die packages including a mounting substrate and dice attached thereto. The mounting substrate includes multiple die attach sites and a designator having substrate identification information. The die attach sites are evaluated and categorized as either good or defective die attach sites, wherein the evaluated information is saved in an electronic file as mapped information. A die attach apparatus attaches dice to the die attach sites in accord with the mapped information, wherein known good dice are attached to the good die attach sites and known defective dice are attached to the defective die attach sites. The assembly is then encapsulated in a transfer molding operation.
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Farnworth Warren M.
Gochnour Derek J.
TraskBritt
Zarneke David A.
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