Substrate level bonding method and substrate level package

Details Substrate level bonding method and substrate level package Substrate level bonding method and substrate level package

2011-08-16

2011-08-16

Geyer, Scott B (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S118000

Reexamination Certificate

active

07998834

ABSTRACT:
Disclosed are a substrate level bonding method and a substrate level package formed thereby. The substrate level package includes a plurality of unit substrate sections, a base substrate, and a plurality of substrate adhesion sections. The unit substrate sections are separated from each other by holes. The base substrate is disposed to face the unit substrate sections. The substrate adhesion sections are interposed between the unit substrate sections and the base substrate to bond the unit substrate sections to the base substrate and which are formed of DFR material, whose at least one portion is uncured.

REFERENCES:
patent: 2007/0243662 (2007-10-01), Johnson et al.
patent: 11-68294 (1999-03-01), None
patent: 11-86723 (1999-03-01), None
patent: 10-2006-0073316 (2006-06-01), None

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