Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2008-04-14
2011-11-01
Zarneke, David (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257SE27122
Reexamination Certificate
active
08049287
ABSTRACT:
A substrate-level assembly having a device substrate of semiconductor material with a top face and housing a first integrated device, including a buried cavity formed within the device substrate, and with a membrane suspended over the buried cavity in the proximity of the top face. A capping substrate is coupled to the device substrate above the top face so as to cover the first integrated device in such a manner that a first empty space is provided above the membrane. Electrical-contact elements electrically connect the integrated device with the outside of the substrate-level assembly. In one embodiment, the device substrate integrates at least a further integrated device provided with a respective membrane, and a further empty space, fluidly isolated from the first empty space, is provided over the respective membrane of the further integrated device.
REFERENCES:
patent: 5591679 (1997-01-01), Jakobsen et al.
patent: 5889872 (1999-03-01), Sooriakumar et al.
patent: 6088463 (2000-07-01), Rombach et al.
patent: 6437412 (2002-08-01), Higuchi et al.
patent: 6541832 (2003-04-01), Coyle
patent: 6732588 (2004-05-01), Mullenborn et al.
patent: 6781231 (2004-08-01), Minervini
patent: 7436054 (2008-10-01), Zhe
patent: 7763488 (2010-07-01), Goodelle et al.
patent: 2004/0099918 (2004-05-01), Noguchi et al.
patent: 2007/0040231 (2007-02-01), Harney et al.
patent: 2009/0101998 (2009-04-01), Yen et al.
patent: 1577656 (2004-03-01), None
patent: 1684079 (2006-07-01), None
patent: 11111878 (1999-04-01), None
patent: 2003-163998 (2003-06-01), None
patent: 2004/068094 (2004-08-01), None
patent: 2007/112743 (2007-10-01), None
Sebastiano, Conti et al., “Assembly of a Capacitive Acoustic Transducer of the Microelectromechanical Type and Package Thereof,” U.S. Appl. No. 12/777,058, filed May 10, 2010, 48 pages.
Baldo Lorenzo
Combi Chantal
Lasalandra Ernesto
Magugliani Manuela
Riva Caterina
Iannucci Robert
Jorgenson Lisa K.
Seed IP Law Group PLLC
STMicroelectronics S.r.l.
Wagner Jenny L.
LandOfFree
Substrate-level assembly for an integrated device,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Substrate-level assembly for an integrated device,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Substrate-level assembly for an integrated device,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4265725