Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-11-07
1989-10-31
Hoag, Willard
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
118728, 118503, H01L 2105, H01L 2184, C30B 2508, C30B 2306
Patent
active
048775738
ABSTRACT:
A holder for supporting a compound semiconductor wafer such as GaAs during MBE heating includes a molybdenum ring, a tantalum ring for supporting the wafer therebetween uniformly about its outer edge, and a sapphire wafer, opposite the compound semiconductor wafer, fixedly attached to the molybdenum ring. The sapphire wafer prevents arsenic loss during heating and transmits infrared radiation to reach the compound semiconductor wafer.
REFERENCES:
patent: 3507248 (1970-04-01), Seeley et al.
patent: 3589936 (1971-06-01), Tramposch
patent: 4492852 (1985-01-01), Finegan et al.
patent: 4592307 (1986-06-01), Jolly
patent: 4699083 (1987-10-01), Huet et al.
patent: 4806321 (1989-02-01), Nishizawa et al.
Hoag Willard
Kramsky Elliott N.
Litton Systems Inc.
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