Optics: measuring and testing – Dimension – Thickness
Reexamination Certificate
2006-07-25
2006-07-25
Pham, Hoa Q. (Department: 2877)
Optics: measuring and testing
Dimension
Thickness
Reexamination Certificate
active
07081963
ABSTRACT:
The invention discloses a substrate holder (8) that is configured to receive a substrate (20) and can be utilized to determine the thickness deviation of a substrate from the standard thickness of a specific substrate type. The substrate holder (8) comprises a one-piece frame having a flat upper surface (42). An opening (30) that defines a peripheral rim (32) is provided in the substrate holder (8). Receiving elements (34) on which spheres are provided are shaped onto the peripheral rim (32) of the opening (30). A substrate (20) placed into the substrate holder (8) thus comes to rest on the upper surfaces of the spheres. The support elements (34) are arranged on the peripheral rim of the opening (30) in such a way that they lie at the vertices of an equilateral triangle. In addition, the spacing from the upper surface of the spheres to the flat upper surface (42) of the substrate holder (8) is dimensioned such that said spacing corresponds substantially to the standard thickness of the substrate type being used.
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SPIE, vol. 3096-0277-786X/97, pp. 433-444 entitles “Advanced Mask Metrology System for up to 4Gbit DRAM” by Taro Ototake et. al.
SPIE, vol. 3096-0277-786X/97, pp. 433-444 entitled “Advanced Mask Metrology System for up to 4Gbit DRAM” by Taro Ototake et al.
Blaesing-Bangert Carola
Kaczynski Ulrich
Crowell & Moring LLP
Leica Microsystems Semiconductor GmbH
Pham Hoa Q.
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