Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1996-01-31
1996-11-26
Bueker, Richard
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156345, 267287, 267903, 118503, B23Q 300
Patent
active
055781675
ABSTRACT:
The etching of a thin substrate (23) is performed using a holder (10). The holder (10) has a base (11) that has a cavity (20). The cavity (20) is pressurized to compensate for the pressure and stress that is applied to the substrate (23) by an etchant solution. The holder (10) also has a sequence of o-rings (22,24,26) that are used to hold the substrate (23) in place and to prevent etchant from leaking into the cavity (20) and attacking a bottom surface (32) of the substrate (23). The pressure necessary to hold the substrate (23) in place is applied by a cover ring (28) that is screwed onto the base (11).
REFERENCES:
J. Kung et al., "A Compact, Inexpensive Apparatus for One-sided Etching in KOH and HF", Sensors and Actuators A, 29 (1991), pp. 209-215.
Albrecht Colleen M.
Dunlap Thomas J.
Sooriakumar Kathirgamasundaram
Stegall Kenneth E.
Switzer Steven A.
Bueker Richard
Motorola Inc.
Neel Bruce T.
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