Substrate having dummy conductors to prevent solder build-up

Details Substrate having dummy conductors to prevent solder build-up Substrate having dummy conductors to prevent solder build-up

1983-01-17

1985-10-01

Corbin, John K.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

350357, 350320, 156901, G02F 113

Patent

active

045442380

ABSTRACT:
A substrate having a conductor path of solderable material arranged thereon and having a solder layer applied to the conductor path by contact as the conductor path moves along molten solder material. In order to apply the solder material in uniform thickness with little deviation of tolerance onto the conductor path, another conductor path and/or a dummy conductor path of corresponding construction to the latter is arranged on the substrate closely alongside of the conductor path.

REFERENCES:
patent: 3928658 (1975-12-01), Van Boxtel et al.

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