Substrate for stressed systems and method of making same

Details Substrate for stressed systems and method of making same Substrate for stressed systems and method of making same

2006-03-07

2006-03-07

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

With means to increase breakdown voltage threshold

With physical configuration of semiconductor surface to...

C257S618000

Reexamination Certificate

active

07009270

ABSTRACT:
A stress absorbing microstructure assembly including a support substrate having an accommodation layer that has plurality of motifs engraved or etched in a surface, a buffer layer and a nucleation layer. The stress absorbing microstructure assembly may also include an insulating layer between the buffer layer and the nucleation layer. This assembly can receive thick epitaxial layers thereon with concern of causing cracking of such layers.

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