Substrate for semiconductor modules and method of manufacture

Details Substrate for semiconductor modules and method of manufacture Substrate for semiconductor modules and method of manufacture

1983-12-06

1985-09-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156656, 1566591, 156666, 156901, 156 89, 1563082, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

045404623

ABSTRACT:
A method for manufacturing a semiconductor substrate. A copper sheet is placed on a surface of a ceramic plate and bonded thereto. A circuit pattern is then formed on the copper sheet by an etching process.

REFERENCES:
patent: 3328145 (1967-06-01), McMillan et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4293356 (1981-10-01), Ebata et al.
patent: 4328048 (1982-05-01), Senda et al.
B.BC. Nachrichten, vol. 64, No. 7, 1982, pp. 196-200, Mannheim, DE. A. Neidig: "Neue Leistungs-Halbleiter-Module mit hofer Lastwechselfestigkeit".

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