Substrate for pre-soldering material and fabrication method...

Details Substrate for pre-soldering material and fabrication method... Substrate for pre-soldering material and fabrication method...

2006-09-26

2006-09-26

Fourson, George R. (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S108000, C438S674000, C438S652000

Reexamination Certificate

active

07112524

ABSTRACT:
A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.

REFERENCES:
patent: 5592025 (1997-01-01), Clark et al.
patent: 2002/0092894 (2002-07-01), Wang et al.
patent: 2003/0001240 (2003-01-01), Whitehair et al.
patent: 2004/0166617 (2004-08-01), Moriizumi et al.

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