Substrate for IC package

Details Substrate for IC package Substrate for IC package

2006-12-26

2006-12-26

Kebede, Brook (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S703000, C257S687000, C438S015000, C438S026000, C438S051000, C438S106000

Reexamination Certificate

active

07154169

ABSTRACT:
A packaging substrate is formed of an array of packaging units. Each packaging unit includes a chip pad on which a chip is carried, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member filling up the open space and forming with the pins and the chip pad a platform, and lead wires located at the insulative member for connecting pins directly or through a passive component.

REFERENCES:
patent: 6803254 (2004-10-01), Park et al.
patent: 2005/0029645 (2005-02-01), Mess et al.

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