Substrate for carrying a semiconductor chip and...

Details Substrate for carrying a semiconductor chip and... Substrate for carrying a semiconductor chip and...

2005-12-20

2005-12-20

Vu, Hung (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S778000, C257S784000

Reexamination Certificate

active

06977443

ABSTRACT:
The objective of this invention is to provide a type of substrate for carrying a semiconductor chip that can increase the arrangement density of lands, and a type of semiconductor device that makes use of said substrate for carrying a semiconductor chip. Constitution: The conductor pattern on insulating substrate102contains lands130that are respectively connected to electrode pads120of semiconductor chip100via conductor wires110.Each land130of conductor pattern110as capillary tool contact portion202where the capillary tool makes contact during bonding, and wire contact portion204that allows contact of conductor wire110.The portion of wire contact portion204on the side toward capillary tool contact portion202becomes constricted portion200.Lands130are positioned such that constricted portion200and capillary tool contact portion202of adjacent lands130are arranged facing each other.

REFERENCES:
patent: 5731709 (1998-03-01), Pastore et al.
patent: 6596561 (2003-07-01), Takahashi et al.

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