Drying and gas or vapor contact with solids – Process – With fluid current conveying or suspension of treated material
Patent
1998-07-06
2000-06-13
Wilson, Pamela A.
Drying and gas or vapor contact with solids
Process
With fluid current conveying or suspension of treated material
34451, 34461, 34 62, F26B 308
Patent
active
060733667
ABSTRACT:
A method and apparatus is disclosed for cooling a substrate between high temperature thermal processing steps. In the disclosed embodiment, one or more cooling stations are located off-line within a wafer handling chamber, just outside the thermal processing chamber. After thermal processing, a hot wafer can be loaded on to the cooling station, where the wafer is subjected to forced convection cooling. In particular, the wafer is subjected to cooling gas from above and below through perforated upper and lower shower head assemblies. The wafer can thus be cooled rapidly on a cooling station while other wafers are transferred into and out of the processing chamber. Desirably, the wafer is cooled on the cooling station to a point at which it can be handled by a low temperature wafer handler and stored in a low temperature cassette.
REFERENCES:
patent: 3322577 (1967-05-01), Smith, Jr.
patent: 3656454 (1972-04-01), Schrader
patent: 4566726 (1986-01-01), Correnti et al.
patent: 4717645 (1988-01-01), Kato et al.
patent: 4949783 (1990-08-01), Lakios et al.
patent: 5033407 (1991-07-01), Mizuno et al.
patent: 5080549 (1992-01-01), Goodwin et al.
patent: 5181556 (1993-01-01), Hughes
patent: 5248370 (1993-09-01), Tsui et al.
patent: 5259883 (1993-11-01), Yamabe et al.
patent: 5372648 (1994-12-01), Yamamoto et al.
patent: 5443997 (1995-08-01), Tsui et al.
patent: 5447409 (1995-09-01), Grunes et al.
patent: 5494529 (1996-02-01), Ciccarelli et al.
patent: 5520742 (1996-05-01), Ohkase
patent: 5607009 (1997-03-01), Turner et al.
patent: 5855681 (1999-01-01), Maydan et al.
patent: 5882413 (1999-03-01), Beaulieu et al.
ASM America Inc.
Wilson Pamela A.
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