Substrate clamping apparatus

Details Substrate clamping apparatus Substrate clamping apparatus

1997-09-22

2000-12-05

Underwood, Donald W.

Material or article handling

Horizontally swinging load support

Swinging about pivot

41422601, 41422605, 414806, 414808, 901 31, 901 39, 2941031, 294 871, B66C 2300, B25J 1500

Patent

active

061557730

ABSTRACT:
The present invention generally provides a robot that can transfer two workpieces, such as silicon wafers, simultaneously and at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two clamp fingers connected to a single flexure member to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except near fall extension of the workpiece handling member to deliver or pick up a wafer.

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