Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2007-08-14
2007-08-14
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C118S500000
Reexamination Certificate
active
10631650
ABSTRACT:
A semiconductor substrate centering mechanism includes a plurality of substrate support pins, each pin having a top surface. The top surfaces of the pins define a plane in which the substrate is supported. Each pin has a tab mounted eccentrically at the top surface of the pin. The tabs extend upwardly relative to the top surfaces of the pins. The centering mechanism further includes a pin rotation mechanism adapted to rotate each pin. The pin rotation mechanism rotates the pins between a first position in which the tabs define an envelope that is larger than a circumference of the substrate and a second position in which the tabs define a centered position for the substrate. A telescoping arrangement of nesting shield segments may also be provided for each pin to prevent processing fluid from reaching a shaft of the pin. In one aspect the centering mechanism is coupled to a substrate support of a substrate processing location, and thus allows a substrate to be centered as it is lowered to the processing location.
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Lerner Alexander
Olgato Donald
Tepman Avi
Applied Materials Inc.
Dang Phuc T.
Dugan & Dugan PC
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