Substrate based ESD network protection for a flip chip

Details Substrate based ESD network protection for a flip chip Substrate based ESD network protection for a flip chip

2007-09-25

2007-09-25

Lebentritt, Michael (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Regenerative type switching device

Device protection

C257S328000, C257S355000, C257S358000, C257S404000, C257S758000, C257S778000, C438S108000, C438S731000, C361S056000, C361S091100

Reexamination Certificate

active

11009450

ABSTRACT:
In accordance with the objectives of the invention a new arrangement is provided for ESD protection of mounted flip chips. In a first embodiment of the invention, the Input/Output cells and power cells are provided with ESD protection that is connected to a dedicated bump pad. The substrate of the flip chip package interconnects all of the dedicated bump pads, completing the ESD network. Under the second embodiment of the invention, the Input/Output cells and power cells are provided with ESD protection that is connected to a dedicated bump pad, a last metal layer interconnects all of the dedicated bump pads, completing the ESD network.

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