Substrate and device comprising interconnection structures

Details Substrate and device comprising interconnection structures Substrate and device comprising interconnection structures

1990-03-20

1991-10-29

Larkins, William D.

357 65, 357 69, H01L 2348, H01L 2944, H01L 2952, H01L 2940

Patent

active

050619845

ABSTRACT:
For face-down bonding by means of (pressure) contacts interconnection structures (bumps) 3 are provided in rows or line arrangements (11) on a substrate 2. This leads to a better distribution of elastical tensions in the substrate 2 and to more reliable contacts.

REFERENCES:
patent: 4145120 (1979-03-01), Kubota
patent: 4604644 (1986-08-01), Beckham et al.

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