Submicron Josephson junction and method for its fabrication

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156656, 156657, 156667, 505 1, 505728, 505832, 437910, 437189, B44C 122, C03C 1500, C03C 2506, C23F 100

Patent

active

052863360

ABSTRACT:
A Josephson junction and a method for its fabrication in which a laminated junction layer is formed in situ on the side edge of a base electrode contact. The laminated junction layer forms the Josephson junction of the present invention and includes an insulating or barrier layer sandwiched between a superconducting base electrode and a superconducting counter electrode. The Josephson junction is formed on the side edge of the base electrode contact to allow very small junction areas to be fabricated using conventional optical lithographic techniques, such as photolithography. The laminated junction layer is formed in situ, with the three layers of the laminated junction layer being formed successively without removing the device from the controlled atmosphere of the deposition system, to prevent contamination of the junction region.

REFERENCES:
patent: 4904619 (1990-02-01), Yamada et al.
patent: 4933318 (1990-06-01), Heijman
patent: 5047390 (1991-09-01), Higashino et al.
patent: 5215960 (1993-06-01), Tanaka et al.

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