Structures and methods for wire bonding over active, brittle...

Details Structures and methods for wire bonding over active, brittle... Structures and methods for wire bonding over active, brittle...

2007-02-13

2007-02-13

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S780000, C257S781000, C257S782000, C257S783000, C257S784000

Reexamination Certificate

active

10973172

ABSTRACT:
Disclosed are structures and methods that facilitate the use of wire bonding technology over active areas of an IC chip. The invention is also suitable for use with IC structures that use brittle dielectric materials such as low K dielectrics.

REFERENCES:
patent: 4000842 (1977-01-01), Burns
patent: 5053851 (1991-10-01), Berndlmaier et al.
patent: 6020647 (2000-02-01), Skala et al.
patent: 64-57741 (1989-03-01), None

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