Structure to reduce signal cross-talk through semiconductor...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Charge transfer device

Reexamination Certificate

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C438S197000, C438S220000, C438S221000

Reexamination Certificate

active

07052939

ABSTRACT:
A structure that reduces signal cross-talk through the semiconductor substrate for System-On-Chip (SOC) (2) applications, thereby facilitating the integration of digital circuit blocks (6) and analog circuit blocks (8) onto a single IC. Cross-circuit interaction through a substrate (4) is reduced by strategically positioning the various digital circuit blocks (6) and analog circuit blocks (8) in an isolated wells (10), (12), (16) and (20) over a resistive substrate (4). These well structures (10), (12), (16), and (20) are then surrounded with a patterned low resistivity layer (22) and optional trench region (24). The patterned low resistivity region (22) is formed below wells (10) and (12) and functions as a low resistance AC ground plane. This low resistivity region (22) collects noise signals that propagate between digital circuit blocks (6) and analog circuit blocks (8).

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Ivan To et al., “Comprehensive Study of Substrate Noise Isolation for Mixed-Signal Circuits,” IEDM, 2001.
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PCT Search Report, PCT/US03/36563 mailed May 11, 2004.

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