Structure of power mosfets, including termination structures

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257377, 257382, 257401, 257412, 257620, 257635, 257754, 257773, H01L 2968

Patent

active

055214096

ABSTRACT:
A power MOSFET is created from a semiconductor body (2000 and 2001) having a main active area and a peripheral termination area. A first insulating layer (2002), typically of substantially uniform thickness, lies over the active and termination areas. A main polycrystalline portion (2003A/2003B) lies over the first insulating layer largely above the active area. First and second peripheral polycrystalline segments (2003C1 and 2003C2) lie over the first insulating layer above the termination area.
A gate electrode (2016) contacts the main polycrystalline portion. A source electrode (2015A/2015B) contacts the active area, the termination area, and the first polycrystalline segment. An optional additional metal portion (2019) contacts the second polycrystalline segment. In this case, the second polycrystalline segment extends over a scribe-line section of the termination area so as to be scribed during a scribing operation.

REFERENCES:
patent: 4191603 (1980-03-01), Gabarino et al.
patent: 4375999 (1983-03-01), Nawata et al.
patent: 4399449 (1983-08-01), Herman et al.
patent: 4532534 (1985-07-01), Ford et al.
patent: 4584025 (1986-04-01), Takaoaka et al.
patent: 4593302 (1986-06-01), Lidow et al.
patent: 4620211 (1986-10-01), Baliga et al.
patent: 4646117 (1987-02-01), Temple
patent: 4680853 (1987-07-01), Lidow et al.
patent: 4803532 (1989-02-01), Mihara
patent: 4819044 (1989-04-01), Murakami
patent: 4974059 (1990-11-01), Kinzer
patent: 4982249 (1991-01-01), Kim et al.
patent: 5016066 (1991-05-01), Takahashi
patent: 5034346 (1991-07-01), Alter et al.
patent: 5094900 (1992-03-01), Langley
patent: 5171699 (1992-12-01), Hutter et al.
patent: 5250449 (1993-10-01), Kuroyanagi et al.
patent: 5268586 (1993-12-01), Mukherjee et al
patent: 5298442 (1994-03-01), Bulucea et al.
patent: 5404040 (1995-04-01), Hshieh et al.
IEEE Transactions On Electron Devices, "High-Voltage Planar Devices Using Field Plate and Semi-Resistive Layers", vol. 38, No., 7 Jul. 1991, New York, pp. 1681-1684, D. Jaume, et al.
Antognetti, Power Imtegrated Circuits: Physics, Design, and Applications (McGraw-Hill Book Co.), 1986, pp. 3.14-3.27.
Baliga, Modern Power Devices (Wiley-Interscience), 1987, pp. 62-131.
"SMP60N06, 60N05, SMP50N06, 50N05, N-Channel Enhancement Mode Transistors," MOSPOWER Data Book, Siliconix inc., 1988, pp. 4-423 - 4-426.
Jaume et al, "High-Voltage Planar Devices Using Field Plate and Semi-Resistive Layers", IEEE Trans. on Electron Devs., Jul. 1991, pp. 1681-1684.
Takemura et al, "BSA Technology for Sub-100nm Deep Base Bipolar Transistors", Int'l Elec. Devs. Meeting, 1987, pp. 375-378. Jan.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Structure of power mosfets, including termination structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure of power mosfets, including termination structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure of power mosfets, including termination structures will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-788765

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.