Structure of bump electrode and method of forming the same

Details Structure of bump electrode and method of forming the same Structure of bump electrode and method of forming the same

1997-10-08

2000-06-20

Everhart, Caridad

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438951, 438670, H01L 2144

Patent

active

060777656

ABSTRACT:
A method of forming a bump electrode, comprises the steps of preparing an Si-substrate having a plurality of bonding pads, forming a core on a substantially central portion of the bonding pad on the substrate, forming a resist layer around the core, which has a greater plan-view shape than the core and is provided with an opening portion through which that portion of the bonding pad, which is located around the core, is exposed, and coating an electric conduction strip having a uniform thickness on peripheral and upper surfaces of the core and on that portion of the bonding pad, which is located around the core, by a plating method.

REFERENCES:
patent: 5251806 (1993-10-01), Agarwala et al.
patent: 5808853 (1998-09-01), Dalal et al.

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