Structure/method to form bottom spin valves for ultra-high...

Details Structure/method to form bottom spin valves for ultra-high... Structure/method to form bottom spin valves for ultra-high...

2006-03-27

2008-07-01

Castro, Angel A (Department: 2627)

Dynamic magnetic information storage or retrieval

Head

Magnetoresistive reproducing head

Reexamination Certificate

active

07394625

ABSTRACT:
Two embodiments of a GMR sensor of the bottom spin valve (BSV) spin filter spin valve (SFSV) type are provided together with methods for their fabrication. In each embodiment the sensor includes an in-situ naturally oxidized specularly reflecting layer (NOL) which is a more uniform and dense layer than such layers formed by high temperature annealing or reactive-ion etching. In one embodiment, the sensor has an ultra thin composite free layer and a high-conductance layer (HCL), providing high output and low coercivity. In a second embodiment, along with the same NOL, the sensor has a laminated free layer which includes a non-magnetic conductive layer, which also provides high output and low coercivity. The sensors are capable of reading densities exceeding 60 Gb/in2.

REFERENCES:
patent: 6268985 (2001-07-01), Pinarbasi
patent: 6338899 (2002-01-01), Fukuzawa et al.
patent: 6348274 (2002-02-01), Kamiguchi et al.
patent: 6466418 (2002-10-01), Horng et al.
patent: 6785954 (2004-09-01), Horng et al.
patent: 6993827 (2006-02-01), Horng et al.
patent: 2005/0047028 (2005-03-01), Fukuzawa et al.
patent: 2006/0162148 (2006-07-01), Horng et al.

Affiliated with

Also associated with

Rating

Structure/method to form bottom spin valves for ultra-high... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure/method to form bottom spin valves for ultra-high..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure/method to form bottom spin valves for ultra-high... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3973377