Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2005-04-12
2005-04-12
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C438S746000
Reexamination Certificate
active
06878634
ABSTRACT:
A structure having recesses and projections is provided. A method of manufacturing the structure comprises the steps of preparing a first substrate having a projection, forming a first layer on the projection, transferring the first layer to a second substrate, and forming a recessed/projected surface structure in the second substrate by using the first layer.
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Den Tohru
Imada Aya
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Ghyka Alexander
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