Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1992-02-28
1996-08-06
Thomas, Laura
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174250, 29829, H05K 111
Patent
active
055435840
ABSTRACT:
The present invention relates generally to a new method of repairing electrical lines, and more particularly to repairing electrical lines having an opening at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the opening with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.
REFERENCES:
patent: 3406246 (1968-10-01), Davidson et al.
patent: 3469015 (1969-09-01), Warren
patent: 3762040 (1973-10-01), Burns et al.
patent: 4259367 (1981-03-01), Dougherty, Jr.
patent: 4417392 (1983-11-01), Ibrahim et al.
patent: 4418264 (1983-11-01), Thorwarth
patent: 4489364 (1984-12-01), Chance
patent: 4546413 (1985-10-01), Feinberg et al.
patent: 4562092 (1985-12-01), Wiech
patent: 4572941 (1986-02-01), Sciaky et al.
patent: 4588468 (1986-05-01), McGinty et al.
patent: 4630355 (1986-12-01), Johnson
patent: 4675717 (1987-06-01), Herrero et al.
patent: 4683652 (1987-08-01), Harfield
patent: 4691426 (1987-09-01), Roucek et al.
patent: 4694138 (1987-09-01), Oodaira et al.
patent: 4704304 (1987-11-01), Amendola et al.
patent: 4714815 (1987-12-01), Swarts et al.
patent: 4739389 (1988-04-01), Goedbloed
patent: 4797530 (1989-01-01), Iwase
patent: 4880959 (1989-11-01), Baum et al.
patent: 4912843 (1990-03-01), Dederer
patent: 5052102 (1991-10-01), Fong et al.
S. Mutnick, "Repairing Breaks in Printed Circuits," IBM Technical Disclosure Bulletin, vol. 8, No. 11, p. 1469 (Apr. 1966).
A. D. Jones, et al., "Solder Coating Thin Copper Wire," IBM Technical Disclosure Bulletin, vol. 11, No. 7, p. 876 (Dec. 1968).
D. E. Hobbs, et al., "Solder Coating Thin Copper Wire," IBM Technical Disclosure Bulletin, vol. 12, No. 2, 361 (Jul. 1969).
F. M. Tappen, "Open Conductor Repair for Glass Metal Module," IBM Technical Disclosure Bulletin, vol. 14, No. 10, p. 2915 (Mar. 1972).
R. E. Mackey, et al., "Conductive Line Jumper/Repair Connection in Glass Metal Module," IBM Technical Disclosure Bulletin, vol. 15, No. 8, p. 2423 (Jan. 1973).
J. L. DeMarco, et al., "Process for Forming Jumpers," IBM Technical Disclosure Bulletin, vol. 22, No. 6, p. 2259 (Nov. 1979).
P. Bakos, et al., "Circuit Repair/Work of Metallized Polyimide Substrates," IBM Technical Disclosure Bulletin, vol. 22, No. 9, pp. 3986-3987 (Feb. 1980).
J. A. Brunner, et al., "Laser Repair of Screened Metallurgy," IBM Technical Disclosure Bulletin, vol. 22, No. 12, p. 5319 (May 1980).
P. Bakos, et al., "Protecting Repair Wires on Printed Circuit Boards," IBM Technical Disclosure Bulletin, vol. 24, No. 2, p. 1242 (Jul. 1981).
C. J. Anderson, et al., "Josephson Package Repair," IBM Technical Disclosure Bulletin, vol. 26, No. 12, pp. 6244-6245 (May 1984).
F. Gobran, "Tailless Thermo-Compression Bonding,"IBM Technical Disclosure Bulletin, vol. 27, No. 5, p. 3041 (Oct. 1984).
"Laser Ablative Cleaning of Bonding Surfaces," IBM Technical Disclosure Bulletin, vol. 32, No. 4A, pp. 429-430 (Sep. 1989).
T. H. Baum, "Laser Chemical Vapor Deposition of Gold-The Effect of Organometallic Structure," Jrl. of the Electrochemical Soc.: Solid State Science And Technology, vol. 134, No. 10, pp. 2616-2619 (Oct. 1987).
Handford Edward F.
Harvilchuck Joseph M.
Interrante Mario J.
Jackson Raymond A.
Master Raj N.
Ahsan Aziz M.
International Business Machines - Corporation
Thomas Laura
LandOfFree
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