Structure for providing an electrical connection between circuit

Details Structure for providing an electrical connection between circuit Structure for providing an electrical connection between circuit

1996-07-03

1998-03-03

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

257418, 257420, 257692, H01L 2982

Patent

active

057238944

ABSTRACT:
An electrical connection structure interconnects a first circuit member and a second circuit member and comprises a cantilever, a conductive needle, a terminal pad and a fixing element. The cantilever is formed in the semiconductor substrate and has an end remote from the semiconductor substrate. The conductive needle is at the end of the cantilever and is electrically connected to the first circuit member. The terminal pad is located on the second circuit member opposite the conductive needle tip when the first circuit member and the second circuit member are juxtaposed. The terminal pad is electrically connected to the second circuit member. The fixing element fixes the first circuit member juxtaposed to the second circuit member in a way that stresses the cantilever to apply a contact force between the conductive needle and the terminal pad.

REFERENCES:
patent: 5536963 (1996-07-01), Polla
patent: 5602422 (1997-02-01), Schueller et al.
G. Messner, et al., "Thin Film Multichip Modules", ISHM,, 1992, pp. 363-393.
C. Boyko et al., "Film Redistribution Layer Technology", ICEMM Proceedings '93, 1993, pp. 196-199.
E. Hatanaka et al., "Multi Chip Module Vol. 2-A Product Design and Low Cost MCM Technology in a Multi-Media Era", 1st. edition, Tokyo: Science Forum, Ltd., 1994, pp. 62-70.
"Basic Seminar on the Electronics Packaging Technology Vol. 1 General Discussion", Ed. Hybrid Micro-Electronics Association, 1st. Edition, Tokyo:#Kogyou Chosa Kai Ltd., 1994, pp. 188-239.

Affiliated with

Also associated with

Rating

Structure for providing an electrical connection between circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure for providing an electrical connection between circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure for providing an electrical connection between circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2251201