Structure for mounting a high-frequency package

Details Structure for mounting a high-frequency package Structure for mounting a high-frequency package

1998-11-25

2000-05-02

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

257691, 257758, 257701, 257700, 257738, 257777, 257778, H05K 100, H01L 2312, H01L 2300

Patent

active

060576006

ABSTRACT:
A structure for mounting a high-frequency device on an insulating board having a circuit on a top surface and transmitting signals to the high-frequency device. The high-frequency device is sealed within a cavity on a top surface of a dielectric board. The dielectric board has a first signal transmission line on its top surface and a second signal transmission line on its bottom surface, the first and second signal transmission lines overlapping each other over a portion where the signal is transmitted through coupling of the first and second signal transmission lines. A recess is formed at the top surface of the insulating board below the overlapping portion of the first and second signal transmission lines to suppress transmission loss of the high-frequency signal between the first and second signal transmission lines. The recess may be filled with air or a material having a dielectric constant low than that of the insulating board.

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