4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. For high frequency device

Shigeki Morioka

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High-frequency module coupled via aperture in a ground plane

Wave transmission lines and networks – Long line elements and components – Strip type
Reexamination Certificate

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Structure for mounting a high-frequency package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Patent

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Profile ID: LFUS-PAI-P-1562076

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