Structure for implementing secure multichip modules for...

Registers – Records – Conductive

Reexamination Certificate

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C235S487000

Reexamination Certificate

active

07806341

ABSTRACT:
A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module.

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KH Williams, “Complete Module Ceramic Circuitize Cap.”, IBM Research Disclosure, Oct. 1987 1p, MA8860088, IBM Corp., Manassas, Virginia, USA.

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