Structure for fixing printed circuit board and method of...

Details Structure for fixing printed circuit board and method of... Structure for fixing printed circuit board and method of...

2007-10-02

2009-08-18

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S753000

Reexamination Certificate

active

07576994

ABSTRACT:
A structure of fixing a printed circuit board includes a mold frame coupled with a display panel, a printed circuit board positioned at a rear surface of the display panel and electrically connected to a pad portion of the display panel, and an insulating film covering an outer surface of the printed circuit board.

REFERENCES:
patent: 6522549 (2003-02-01), Kano et al.
patent: 6708401 (2004-03-01), Miyakawa et al.
patent: 7301776 (2007-11-01), Wang et al.
patent: 2006/0098415 (2006-05-01), Kim et al.
patent: 2006/0139889 (2006-06-01), Lin et al.
patent: 04-220623 (1992-08-01), None
patent: 05-034713 (1993-02-01), None
patent: 2000-181370 (2000-06-01), None
patent: 2000-235176 (2000-08-01), None
patent: 2001-201733 (2001-07-01), None
patent: 2003-157023 (2003-05-01), None

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